DIL Sockets

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Osan tiedot Merkki Number Of Contacts Mounting Type Pin Type Pitch Row Width Frame Type Termination Method Contact Plating Current Rating Orientation Length Width Depth Dimensions Contact Material Housing Material Minimum Operating Temperature Maximum Operating Temperature Voltage Rating Series
TE Connectivity 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A TE Connectivity 28 Through Hole Stamped 2.54mm 15.24mm Open Frame Solder Tin 3A Vertical 35.56mm 4.57mm 17.78mm 35.56 x 4.57 x 17.78mm Beryllium Copper PCT -55°C +105°C - -
TE Connectivity Economy 800 2.54mm Pitch Vertical 20 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A TE Connectivity 20 Through Hole Stamped 2.54mm 7.62mm Open Frame Solder Gold, Tin 3A Vertical 25.4mm 4.57mm 10.16mm 25.4 x 4.57 x 10.16mm Beryllium Copper PCT -55°C +125°C - Economy 800
TE Connectivity Economy 800 2.54mm Pitch Vertical 8 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A TE Connectivity 8 Through Hole Stamped 2.54mm 7.62mm Open Frame Solder Gold, Tin 3A Vertical 10.16mm 4.57mm 10.16mm 10.16 x 4.57 x 10.16mm Beryllium Copper PCT -55°C +125°C - Economy 800
TE Connectivity 2.54mm Pitch Vertical 8 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A TE Connectivity 8 Through Hole Stamped 2.54mm 7.62mm Open Frame Solder Gold 3A Vertical 10.16mm 4.57mm 10.16mm 10.16 x 4.57 x 10.16mm Beryllium Copper PCT -55°C +105°C - -
TE Connectivity 2.54mm Pitch Vertical 16 Way, Through Hole Turned Pin Closed Frame IC Dip Socket TE Connectivity 16 Through Hole Turned 2.54mm 2.54mm Closed Frame Solder Gold - Vertical 20.32mm 10.16mm 4.57mm 20.32 x 10.16 x 4.57mm Beryllium Copper Thermoplastic -55°C +105°C - -
TE Connectivity 2.54mm Pitch Vertical 8 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A TE Connectivity 8 Through Hole Turned 2.54mm 7.62mm Open Frame Solder Gold 3A Vertical 10.16mm 10.16mm 2.67mm 10.16 x 10.16 x 2.67mm Beryllium Copper PET -55°C +105°C - -
TE Connectivity 1-2199298 2.54mm Pitch Straight 14 Way, Through Hole Standard Pin Ladder IC Dip Socket, 1A TE Connectivity 14 Through Hole Standard 2.54mm 7.62mm Ladder Solder Tin over Nickel 1A Straight 17.78mm 10mm 5.1mm 17.78 x 10 x 5.1mm Phosphor Bronze Glass Filled PBT, Thermoplastic -40°C +105°C 250 V ac/dc 1-2199298
TE Connectivity DIPLOMATE 800 2.54mm Pitch Vertical 18 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A TE Connectivity 18 Through Hole Turned 2.54mm 7.62mm Open Frame Solder Gold, Tin 3A Vertical 22.86mm 4.57mm 10.16mm 22.86 x 4.57 x 10.16mm Beryllium Copper PCT -55°C +105°C - DIPLOMATE 800
TE Connectivity Diplomate 2.54mm Pitch Vertical 14 Way, Through Hole Stamped Pin Closed Frame IC Dip Socket TE Connectivity 14 Through Hole Stamped 2.54mm 7.62mm Closed Frame Solder Gold - Vertical 17.65mm 10.01mm 5.33mm 17.65 x 10.1 x 5.33mm Phosphor Bronze Glass Fibre Reinforced Thermoplastic - +125°C - Diplomate
TE Connectivity 2.54mm Pitch Vertical 6 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A TE Connectivity 6 Through Hole Stamped 2.54mm 7.62mm Open Frame Solder Gold over Nickel 3A Vertical 50.8mm 4.57mm 17.78mm 50.8 x 4.57 x 17.78mm Beryllium Copper PCT -55°C +105°C - -
TE Connectivity Economy 800 2.54mm Pitch Vertical 40 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A TE Connectivity 40 Through Hole Stamped 2.54mm 15.24mm Open Frame Solder Gold 3A Vertical 50.8mm 17.78mm 2.67mm 50.8 x 17.78 x 2.67mm Beryllium Copper PET -55°C +105°C - Economy 800
TE Connectivity 2.54mm Pitch Vertical 16 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A TE Connectivity 16 Through Hole Stamped 2.54mm 7.62mm Open Frame Solder Tin 3A Vertical 20.32mm 4.57mm 10.16mm 20.32 x 4.57 x 10.16mm Beryllium Copper PCT -55°C +105°C - -
TE Connectivity 2.54mm Pitch Vertical 16 Way, Through Hole Standard Pin Closed Frame IC Dip Socket TE Connectivity 16 Through Hole Standard 2.54mm 2.54mm Closed Frame Solder Gold - Vertical 20.32mm 10.16mm 4.57mm 20.32 x 10.16 x 4.57mm Beryllium Copper Thermoplastic -55°C +105°C - -
TE Connectivity 2.54mm Pitch Vertical 32 Way, Through Hole Stamped Pin Closed Frame IC Dip Socket TE Connectivity 32 Through Hole Stamped 2.54mm 15.24mm Closed Frame Solder Tin - Vertical 40.51mm 5.33mm 17.63mm 40.51 x 5.33 x 17.63mm Beryllium Copper Thermoplastic -55°C +105°C - -
TE Connectivity Economy 800 2.54mm Pitch Vertical 40 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A TE Connectivity 40 Through Hole Stamped 2.54mm 15.24mm Open Frame Solder Gold, Tin 3A Vertical 50.8mm 4.57mm 17.78mm 50.8 x 4.57 x 17.78mm Beryllium Copper PCT -55°C +105°C - Economy 800
TE Connectivity 2.54mm Pitch Vertical 16 Way, Through Hole Stamped Pin Closed Frame IC Dip Socket, 1A TE Connectivity 16 Through Hole Stamped 2.54mm 7.62mm Closed Frame Solder Tin 1A Vertical 20.32mm 5.1mm 10mm 20.32 x 5.1 x 10mm Phosphor Bronze PBT -40°C +105°C 250 V ac -
TE Connectivity Economy 800 2.54mm Pitch Vertical 16 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A TE Connectivity 16 Through Hole Stamped 2.54mm 7.62mm Open Frame Solder Gold, Tin 3A Vertical 20.32mm 4.57mm 10.16mm 20.32 x 4.57 x 10.16mm Beryllium Copper PCT -55°C +125°C - Economy 800
TE Connectivity Diplomate 2.54mm Pitch Vertical 18 Way, Through Hole Stamped Pin Closed Frame IC Dip Socket TE Connectivity 18 Through Hole Stamped 2.54mm 7.87mm Closed Frame Solder Tin - Vertical - - - - Beryllium Copper Glass Fibre Reinforced Thermoplastic - +105°C - Diplomate
TE Connectivity 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A TE Connectivity 28 Through Hole Stamped 2.54mm 15.24mm Open Frame Solder Gold 3A Vertical 35.56mm 4.57mm 17.78mm 35.56 x 4.57 x 17.78mm Beryllium Copper PET -55°C +105°C - -
TE Connectivity Economy 800 2.54mm Pitch Vertical 14 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A TE Connectivity 14 Through Hole Stamped 2.54mm 7.62mm Open Frame Solder Gold, Tin 3A Vertical 17.78mm 4.57mm 10.16mm 17.78 x 4.57 x 10.16mm Beryllium Copper PCT -55°C +125°C - Economy 800
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