Steel Mechanical Brushed Code Lock

RS tilauskoodi: 687-9877Tuotemerkki: CodelockValmistajan osanumero.: CL615BSIMPA: 0
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Tekninen dokumentti

Tekniset tiedot

Series

TSW-107-07-L-D-006

Kit Type

First Responder Bag

Thread Length

17.5mm

Maximum Output Torque

1482 gcm

Dimensions

210 x 75 x 50mm

Free Length

94mm

Material

Steel

Merkki

Codelock

Alkuperämaa

China

Tuotetiedot

TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Double Row Board to Board Vertical Headers

AMPMODU 50/50 double row board to board SMT PCB mount vertical headers with a high density 1.27mm x 1.27mm centerline and a 6.35mm mated height for parallel board to board applications. These AMPMODU 50/50 board to board headers have metallic board holddowns, dual beam receptacle contacts and black UL 94V-0 LCP housings with keying to aid accurate mating.

TE Connectivity AMPMODU 50/50 1.27mm Connectors

The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.

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Varastotiedot eivät ole tilapäisesti saatavilla.

€ 318,00

kpl (ilman ALV)

€ 394,32

kpl (Sis ALV:n)

Steel Mechanical Brushed Code Lock

€ 318,00

kpl (ilman ALV)

€ 394,32

kpl (Sis ALV:n)

Steel Mechanical Brushed Code Lock
Varastotiedot eivät ole tilapäisesti saatavilla.

Tekninen dokumentti

Tekniset tiedot

Series

TSW-107-07-L-D-006

Kit Type

First Responder Bag

Thread Length

17.5mm

Maximum Output Torque

1482 gcm

Dimensions

210 x 75 x 50mm

Free Length

94mm

Material

Steel

Merkki

Codelock

Alkuperämaa

China

Tuotetiedot

TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Double Row Board to Board Vertical Headers

AMPMODU 50/50 double row board to board SMT PCB mount vertical headers with a high density 1.27mm x 1.27mm centerline and a 6.35mm mated height for parallel board to board applications. These AMPMODU 50/50 board to board headers have metallic board holddowns, dual beam receptacle contacts and black UL 94V-0 LCP housings with keying to aid accurate mating.

TE Connectivity AMPMODU 50/50 1.27mm Connectors

The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.