Tekninen dokumentti
Tekniset tiedot
Series
TSW-107-07-L-D-006
Kit Type
First Responder Bag
Thread Length
17.5mm
Maximum Output Torque
1482 gcm
Dimensions
210 x 75 x 50mm
Free Length
94mm
Material
Steel
Merkki
CodelockAlkuperämaa
China
Tuotetiedot
TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Double Row Board to Board Vertical Headers
AMPMODU 50/50 double row board to board SMT PCB mount vertical headers with a high density 1.27mm x 1.27mm centerline and a 6.35mm mated height for parallel board to board applications. These AMPMODU 50/50 board to board headers have metallic board holddowns, dual beam receptacle contacts and black UL 94V-0 LCP housings with keying to aid accurate mating.
TE Connectivity AMPMODU 50/50 1.27mm Connectors
The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.
Varastotiedot eivät ole tilapäisesti saatavilla.
Tarkista myöhemmin uudelleen.
€ 318,00
kpl (ilman ALV)
€ 394,32
kpl (Sis ALV:n)
1
€ 318,00
kpl (ilman ALV)
€ 394,32
kpl (Sis ALV:n)
1
Tekninen dokumentti
Tekniset tiedot
Series
TSW-107-07-L-D-006
Kit Type
First Responder Bag
Thread Length
17.5mm
Maximum Output Torque
1482 gcm
Dimensions
210 x 75 x 50mm
Free Length
94mm
Material
Steel
Merkki
CodelockAlkuperämaa
China
Tuotetiedot
TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Double Row Board to Board Vertical Headers
AMPMODU 50/50 double row board to board SMT PCB mount vertical headers with a high density 1.27mm x 1.27mm centerline and a 6.35mm mated height for parallel board to board applications. These AMPMODU 50/50 board to board headers have metallic board holddowns, dual beam receptacle contacts and black UL 94V-0 LCP housings with keying to aid accurate mating.
TE Connectivity AMPMODU 50/50 1.27mm Connectors
The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.