Tekninen dokumentti
Tekniset tiedot
Merkki
TE ConnectivityNumber Of Contacts
3
Type
Board to Board
Mounting Type
Through Hole
Body Orientation
Straight
Termination Method
Solder
Current Rating
1.15A
Voltage Rating
250 V
Series
Z-PACK HM
Contact Material
Copper
Alkuperämaa
China
Tuotetiedot
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Varastotiedot eivät ole tilapäisesti saatavilla.
Tarkista myöhemmin uudelleen.
€ 273,00
€ 4,55 1 kpl (60 kpl/putki) (ilman ALV)
€ 342,62
€ 5,71 1 kpl (60 kpl/putki) (Sis ALV:n)
60
€ 273,00
€ 4,55 1 kpl (60 kpl/putki) (ilman ALV)
€ 342,62
€ 5,71 1 kpl (60 kpl/putki) (Sis ALV:n)
60
Tekninen dokumentti
Tekniset tiedot
Merkki
TE ConnectivityNumber Of Contacts
3
Type
Board to Board
Mounting Type
Through Hole
Body Orientation
Straight
Termination Method
Solder
Current Rating
1.15A
Voltage Rating
250 V
Series
Z-PACK HM
Contact Material
Copper
Alkuperämaa
China
Tuotetiedot
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.