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Tuotetiedot
OM-338, Solder Paste & Rework Flux Gel
Lead-free, no-clean solder pastes designed for a broad range of applications. Yields excellent print performance across various board designs with excellent fine feature repeatability. The reflowed residues are safe and reliable meeting with the J-STD-004 and Bellcore GR78-CORE test criteria. Also supplied in gel form for solder rework applications.
Standards
ROL0 Designation to ANSI/J-STD-004
Solder Paste - Lead Free
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Tekninen dokumentti
Tekniset tiedot
Tuotetiedot
OM-338, Solder Paste & Rework Flux Gel
Lead-free, no-clean solder pastes designed for a broad range of applications. Yields excellent print performance across various board designs with excellent fine feature repeatability. The reflowed residues are safe and reliable meeting with the J-STD-004 and Bellcore GR78-CORE test criteria. Also supplied in gel form for solder rework applications.
Standards
ROL0 Designation to ANSI/J-STD-004