Tekninen dokumentti
Tekniset tiedot
Merkki
WinbondMemory Size
1Gbit
Interface Type
Quad-SPI
Package Type
SOIC
Pin Count
16
Organisation
128M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
10.49 x 7.59 x 2.34mm
Number of Words
128M
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Varastotiedot eivät ole tilapäisesti saatavilla.
Tarkista myöhemmin uudelleen.
€ 2,15
1 kpl (44 kpl/putki) (ilman ALV)
€ 2,698
1 kpl (44 kpl/putki) (Sis ALV:n)
44
€ 2,15
1 kpl (44 kpl/putki) (ilman ALV)
€ 2,698
1 kpl (44 kpl/putki) (Sis ALV:n)
44
Tekninen dokumentti
Tekniset tiedot
Merkki
WinbondMemory Size
1Gbit
Interface Type
Quad-SPI
Package Type
SOIC
Pin Count
16
Organisation
128M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
10.49 x 7.59 x 2.34mm
Number of Words
128M
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C