Tekninen dokumentti
Tekniset tiedot
Merkki
WinslowPitch
1.27 mm, 2.54 mm
End 1
6 Pin Female SOP
End 2
6 Pin Male DIP
End 1 Number of Contacts
6
End 2 Number of Contacts
6
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Alkuperämaa
United Kingdom
Tuotetiedot
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
€ 22,00
€ 4,40 1 kpl (5 kpl/pakkaus) (ilman ALV)
€ 27,61
€ 5,522 1 kpl (5 kpl/pakkaus) (Sis ALV:n)
5
€ 22,00
€ 4,40 1 kpl (5 kpl/pakkaus) (ilman ALV)
€ 27,61
€ 5,522 1 kpl (5 kpl/pakkaus) (Sis ALV:n)
Varastotiedot eivät ole tilapäisesti saatavilla.
5
Varastotiedot eivät ole tilapäisesti saatavilla.
| Määrä | Yksikköhinta | Per Pakkaus |
|---|---|---|
| 5 - 120 | € 4,40 | € 22,00 |
| 125 - 370 | € 3,95 | € 19,75 |
| 375 - 995 | € 3,50 | € 17,50 |
| 1000 - 1995 | € 3,05 | € 15,25 |
| 2000+ | € 2,85 | € 14,25 |
Tekninen dokumentti
Tekniset tiedot
Merkki
WinslowPitch
1.27 mm, 2.54 mm
End 1
6 Pin Female SOP
End 2
6 Pin Male DIP
End 1 Number of Contacts
6
End 2 Number of Contacts
6
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Alkuperämaa
United Kingdom
Tuotetiedot
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.


