Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in
Tekninen dokumentti
Tekniset tiedot
Merkki
BergquistDimensions
11 x 12in
Thickness
0.102mm
Length
11in
Width
12in
Thermal Conductivity
1W/m·K
Material
Hi-Flow 225F-AC
Self-Adhesive
Yes
Maximum Operating Temperature
+120°C
Material Trade Name
Hi-Flow 225F-AC
Operating Temperature Range
Maximum of +120 °C
Alkuperämaa
United States
Tuotetiedot
Hi-Flow® 225 FAC
Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules
€ 66,50
€ 66,50 kpl (ilman ALV)
€ 83,46
€ 83,46 kpl (Sis ALV:n)
1
€ 66,50
€ 66,50 kpl (ilman ALV)
€ 83,46
€ 83,46 kpl (Sis ALV:n)
1
Varastotiedot eivät ole tilapäisesti saatavilla.
Tarkista myöhemmin uudelleen.
| Määrä | Yksikköhinta |
|---|---|
| 1 - 49 | € 66,50 |
| 50 - 99 | € 64,00 |
| 100 - 249 | € 59,50 |
| 250 - 499 | € 57,50 |
| 500+ | € 56,00 |
Tekninen dokumentti
Tekniset tiedot
Merkki
BergquistDimensions
11 x 12in
Thickness
0.102mm
Length
11in
Width
12in
Thermal Conductivity
1W/m·K
Material
Hi-Flow 225F-AC
Self-Adhesive
Yes
Maximum Operating Temperature
+120°C
Material Trade Name
Hi-Flow 225F-AC
Operating Temperature Range
Maximum of +120 °C
Alkuperämaa
United States
Tuotetiedot
Hi-Flow® 225 FAC
Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules