Tekninen dokumentti
Tekniset tiedot
Merkki
MolexSeries
MICRO-FIT 3.0
Pitch
3.0mm
Pitch
3mm
Number Of Contacts
2
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
43045
Current Rating
5.0A
Current Rating
5A
Voltage Rating
250.0 V
Alkuperämaa
Mexico
Tuotetiedot
Molex Micro-Fit 3.0 3.0mm Dual Row SMT Headers with Solder Tabs, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Molex Micro-Fit 3.0 Series
€ 7,50
€ 1,50 1 kpl (5 kpl/pakkaus) (ilman ALV)
€ 9,41
€ 1,882 1 kpl (5 kpl/pakkaus) (Sis ALV:n)
5
€ 7,50
€ 1,50 1 kpl (5 kpl/pakkaus) (ilman ALV)
€ 9,41
€ 1,882 1 kpl (5 kpl/pakkaus) (Sis ALV:n)
Varastotiedot eivät ole tilapäisesti saatavilla.
5
Varastotiedot eivät ole tilapäisesti saatavilla.
Määrä | Yksikköhinta | Per Pakkaus |
---|---|---|
5 - 95 | € 1,50 | € 7,50 |
100 - 370 | € 1,05 | € 5,25 |
375 - 1495 | € 1,00 | € 5,00 |
1500 - 2995 | € 0,896 | € 4,48 |
3000+ | € 0,873 | € 4,36 |
Tekninen dokumentti
Tekniset tiedot
Merkki
MolexSeries
MICRO-FIT 3.0
Pitch
3.0mm
Pitch
3mm
Number Of Contacts
2
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
43045
Current Rating
5.0A
Current Rating
5A
Voltage Rating
250.0 V
Alkuperämaa
Mexico
Tuotetiedot
Molex Micro-Fit 3.0 3.0mm Dual Row SMT Headers with Solder Tabs, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.