Tekninen dokumentti
Tekniset tiedot
Merkki
TE ConnectivityPlug/Socket
Socket
Gender
Female
Mounting Type
Through Hole
Termination Method
Press-In
Contact Material
Phosphor Bronze
Housing Material
PET
Contact Plating
Gold over Palladium Nickel over Nickel
Alkuperämaa
United States
Tuotetiedot
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Varastotiedot eivät ole tilapäisesti saatavilla.
Tarkista myöhemmin uudelleen.
€ 7,70
€ 7,70 kpl (ilman ALV)
€ 9,66
€ 9,66 kpl (Sis ALV:n)
Standardi
1
€ 7,70
€ 7,70 kpl (ilman ALV)
€ 9,66
€ 9,66 kpl (Sis ALV:n)
Standardi
1
Tekninen dokumentti
Tekniset tiedot
Merkki
TE ConnectivityPlug/Socket
Socket
Gender
Female
Mounting Type
Through Hole
Termination Method
Press-In
Contact Material
Phosphor Bronze
Housing Material
PET
Contact Plating
Gold over Palladium Nickel over Nickel
Alkuperämaa
United States
Tuotetiedot
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.