Heatsink, Universal Rectangular Alu, 0.14°C/W, 100 x 215 x 77mm, PCB Mount

RS tilauskoodi: 903-3144Tuotemerkki: ABL ComponentsValmistajan osanumero.: 180AB1000B
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Tekninen dokumentti

Tekniset tiedot

For Use With

Universal Rectangular Alu

Length

100mm

Width

215mm

Height

77mm

Dimensions

100 x 215 x 77mm

Thermal Resistance

0.14°C/W

Mounting

PCB Mount

Series

100

Material

Aluminium

Application

High Power Semiconductor Device, Optoelectronic Device

Finish

Anodized

Alkuperämaa

United Kingdom

Tuotetiedot

Heat Sink 180AB Series, 215mm Wide x 77mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

Varastotiedot eivät ole tilapäisesti saatavilla.

€ 76,00

€ 76,00 kpl (ilman ALV)

€ 95,38

€ 95,38 kpl (Sis ALV:n)

Heatsink, Universal Rectangular Alu, 0.14°C/W, 100 x 215 x 77mm, PCB Mount

€ 76,00

€ 76,00 kpl (ilman ALV)

€ 95,38

€ 95,38 kpl (Sis ALV:n)

Heatsink, Universal Rectangular Alu, 0.14°C/W, 100 x 215 x 77mm, PCB Mount
Varastotiedot eivät ole tilapäisesti saatavilla.

Varastotiedot eivät ole tilapäisesti saatavilla.

Tarkista myöhemmin uudelleen.

MääräYksikköhinta
1 - 4€ 76,00
5 - 9€ 72,00
10 - 24€ 67,50
25 - 99€ 64,50
100+€ 43,00

Tekninen dokumentti

Tekniset tiedot

For Use With

Universal Rectangular Alu

Length

100mm

Width

215mm

Height

77mm

Dimensions

100 x 215 x 77mm

Thermal Resistance

0.14°C/W

Mounting

PCB Mount

Series

100

Material

Aluminium

Application

High Power Semiconductor Device, Optoelectronic Device

Finish

Anodized

Alkuperämaa

United Kingdom

Tuotetiedot

Heat Sink 180AB Series, 215mm Wide x 77mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.