Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P

RS tilauskoodi: 752-4897Tuotemerkki: BergquistValmistajan osanumero.: HF650P-0.001-01-00-43
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Tekninen dokumentti

Tekniset tiedot

Merkki

Bergquist

Thickness

0.001in

Thermal Conductivity

1.5W/m·K

Material

Hi-Flow 650P

Self-Adhesive

Yes

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+150°C

Material Trade Name

Hi-Flow 650P

Operating Temperature Range

-40 → +150 °C

PRICED TO CLEAR

Yes

Alkuperämaa

United States

Tuotetiedot

Hi-Flow 650P

Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.

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€ 0,52

1 kpl (50 kpl/pussi) (ilman ALV)

€ 0,645

1 kpl (50 kpl/pussi) (Sis ALV:n)

Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P

€ 0,52

1 kpl (50 kpl/pussi) (ilman ALV)

€ 0,645

1 kpl (50 kpl/pussi) (Sis ALV:n)

Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Varastotiedot eivät ole tilapäisesti saatavilla.

Tekninen dokumentti

Tekniset tiedot

Merkki

Bergquist

Thickness

0.001in

Thermal Conductivity

1.5W/m·K

Material

Hi-Flow 650P

Self-Adhesive

Yes

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+150°C

Material Trade Name

Hi-Flow 650P

Operating Temperature Range

-40 → +150 °C

PRICED TO CLEAR

Yes

Alkuperämaa

United States

Tuotetiedot

Hi-Flow 650P

Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.