HARWIN 5.5mm Grounding Contact

RS tilauskoodi: 788-4868Tuotemerkki: HARWINValmistajan osanumero.: S7061-42R
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Näytä kaikki Grounding Contacts tuotteet

Tekninen dokumentti

Tekniset tiedot

Merkki

HARWIN

Material

Titanium Copper Alloy

Series

EZ-BoardWare

Current Rating

4A

Fixing Method

Surface Mount

Contact Plating

Gold

Dimensions

7 x 2.5 x 5.5mm

Height

5.5mm

Length

7mm

Width

2.5mm

Alkuperämaa

China

Tuotetiedot

Harwin EZ Boardware SMT RFI/Grounding Spring Contacts

EZ-BoardWare SMT grounding/RFI spring contacts for use on surface mount PCBs that are in contact with metal shields or frames. The simple C style design of these EZ-BoardWare spring contacts provides excellent spring properties and ensures positive contact with the mating surface. These EZ-BoardWare RFI/grounding contacts are suitable for both wiping and sliding actions and are ideal for automated requirements using standard placement equipment. Stock numbers 788-4852 and 788-4858 are multi-directional spring contacts that have a unique spring feature that works in both the vertical and horizontal orientations. This feature makes them ideal for use in PCB edge connections to a chassis.

Varastotiedot eivät ole tilapäisesti saatavilla.

Tarkista myöhemmin uudelleen.

Varastotiedot eivät ole tilapäisesti saatavilla.

€ 4,15

€ 0,415 1 kpl (10 kpl/pakkaus) (ilman ALV)

€ 5,21

€ 0,521 1 kpl (10 kpl/pakkaus) (Sis ALV:n)

HARWIN 5.5mm Grounding Contact
Valitse pakkaustyyppi

€ 4,15

€ 0,415 1 kpl (10 kpl/pakkaus) (ilman ALV)

€ 5,21

€ 0,521 1 kpl (10 kpl/pakkaus) (Sis ALV:n)

HARWIN 5.5mm Grounding Contact
Varastotiedot eivät ole tilapäisesti saatavilla.
Valitse pakkaustyyppi

Osta irtotavarana

MääräYksikköhintaPer Pakkaus
10 - 190€ 0,415€ 4,15
200 - 740€ 0,351€ 3,51
750 - 2990€ 0,322€ 3,22
3000 - 5990€ 0,26€ 2,60
6000+€ 0,247€ 2,47

Tekninen dokumentti

Tekniset tiedot

Merkki

HARWIN

Material

Titanium Copper Alloy

Series

EZ-BoardWare

Current Rating

4A

Fixing Method

Surface Mount

Contact Plating

Gold

Dimensions

7 x 2.5 x 5.5mm

Height

5.5mm

Length

7mm

Width

2.5mm

Alkuperämaa

China

Tuotetiedot

Harwin EZ Boardware SMT RFI/Grounding Spring Contacts

EZ-BoardWare SMT grounding/RFI spring contacts for use on surface mount PCBs that are in contact with metal shields or frames. The simple C style design of these EZ-BoardWare spring contacts provides excellent spring properties and ensures positive contact with the mating surface. These EZ-BoardWare RFI/grounding contacts are suitable for both wiping and sliding actions and are ideal for automated requirements using standard placement equipment. Stock numbers 788-4852 and 788-4858 are multi-directional spring contacts that have a unique spring feature that works in both the vertical and horizontal orientations. This feature makes them ideal for use in PCB edge connections to a chassis.