Tekninen dokumentti
Tekniset tiedot
Merkki
MolexNumber Of Rows
2
Pitch
0.5mm
Mounting Type
Through Hole
Body Orientation
Vertical
Termination Method
Solder
Series
Nano-Pitch
Contact Material
Copper Alloy
Alkuperämaa
China
Tuotetiedot
Molex Nano-Pitch I/O Receptacles
From Molex, a series of high density, high performance, low profile I/O connectors. The Nano-Pitch connectors support multi-protocol high-speed demands needed in the latest industry wire to board applications. With their compact design and 0.50 mm pitch, the Nano I/O connectors provide a versatile interconnect solution for both internal and external applications. Available in right angle and vertical options in both surface mount and through hole.
Molex Nano-Pitch I/O Interconnect System
Varastotiedot eivät ole tilapäisesti saatavilla.
Tarkista myöhemmin uudelleen.
€ 6,00
1 kpl (490 kpl/kela) (ilman ALV)
€ 7,44
1 kpl (490 kpl/kela) (Sis ALV:n)
490
€ 6,00
1 kpl (490 kpl/kela) (ilman ALV)
€ 7,44
1 kpl (490 kpl/kela) (Sis ALV:n)
490
Tekninen dokumentti
Tekniset tiedot
Merkki
MolexNumber Of Rows
2
Pitch
0.5mm
Mounting Type
Through Hole
Body Orientation
Vertical
Termination Method
Solder
Series
Nano-Pitch
Contact Material
Copper Alloy
Alkuperämaa
China
Tuotetiedot
Molex Nano-Pitch I/O Receptacles
From Molex, a series of high density, high performance, low profile I/O connectors. The Nano-Pitch connectors support multi-protocol high-speed demands needed in the latest industry wire to board applications. With their compact design and 0.50 mm pitch, the Nano I/O connectors provide a versatile interconnect solution for both internal and external applications. Available in right angle and vertical options in both surface mount and through hole.