Tekninen dokumentti
Tekniset tiedot
Merkki
MolexSeries
MICRO-FIT 3.0
Pitch
3.0mm
Number Of Contacts
22
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
43045
Current Rating
5.0A
Voltage Rating
250.0 V
Tuotetiedot
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs
Molex Micro-Fit 3.0 Series
Varastotiedot eivät ole tilapäisesti saatavilla.
Tarkista myöhemmin uudelleen.
€ 6,40
kpl (toimitus pussissa) (ilman ALV)
€ 8,032
kpl (toimitus pussissa) (Sis ALV:n)
Tuotantopakkaus (Pussi)
5
€ 6,40
kpl (toimitus pussissa) (ilman ALV)
€ 8,032
kpl (toimitus pussissa) (Sis ALV:n)
Tuotantopakkaus (Pussi)
5
Osta irtotavarana
Määrä | Yksikköhinta | Per Pussi |
---|---|---|
5 - 95 | € 6,40 | € 32,00 |
100 - 370 | € 4,55 | € 22,75 |
375 - 1495 | € 4,30 | € 21,50 |
1500 - 2995 | € 3,60 | € 18,00 |
3000+ | € 3,35 | € 16,75 |
Tekninen dokumentti
Tekniset tiedot
Merkki
MolexSeries
MICRO-FIT 3.0
Pitch
3.0mm
Number Of Contacts
22
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
43045
Current Rating
5.0A
Voltage Rating
250.0 V
Tuotetiedot
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs