Tekninen dokumentti
Tekniset tiedot
Merkki
MolexSeries
MICRO-FIT 3.0
Pitch
3.0mm
Number Of Contacts
3
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
43650
Current Rating
5.0A
Voltage Rating
250.0 V
Alkuperämaa
Mexico
Tuotetiedot
Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Molex Micro-Fit 3.0 Series
€ 180,00
€ 1,80 kpl (toimitus teipissä) (ilman ALV)
€ 225,90
€ 2,259 kpl (toimitus teipissä) (Sis ALV:n)
Tuotantopakkaus (Nauha)
100
€ 180,00
€ 1,80 kpl (toimitus teipissä) (ilman ALV)
€ 225,90
€ 2,259 kpl (toimitus teipissä) (Sis ALV:n)
Tuotantopakkaus (Nauha)
100
Varastotiedot eivät ole tilapäisesti saatavilla.
Tarkista myöhemmin uudelleen.
Määrä | Yksikköhinta | Per Nauha |
---|---|---|
100 - 370 | € 1,80 | € 9,00 |
375 - 1495 | € 1,70 | € 8,50 |
1500 - 2995 | € 1,60 | € 8,00 |
3000+ | € 1,50 | € 7,50 |
Tekninen dokumentti
Tekniset tiedot
Merkki
MolexSeries
MICRO-FIT 3.0
Pitch
3.0mm
Number Of Contacts
3
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
43650
Current Rating
5.0A
Voltage Rating
250.0 V
Alkuperämaa
Mexico
Tuotetiedot
Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.