Tekninen dokumentti
Tekniset tiedot
Merkki
PanasonicDimensions
115 x 90mm
Thickness
0.07mm
Length
115mm
Width
90mm
Thermal Conductivity
1000W/m·K
Material
Graphite
Self-Adhesive
Yes
Alkuperämaa
Japan
Tuotetiedot
Panasonic Pyrolytic Graphite Sheet (PGS) Type EYG
These range of Panasonic PGS thermal graphite sheet is a very thin, synthetically-made, highly oriented graphite polymer film manufactured for thermal management/heat-sink applications. The PGS graphite sheets are particularly well-suited for use in constrained spaces or to provide supplemental heat-sinking to existing areas. With excellent thermal conductivity (2 to 4 times that of copper), Panasonic 's PGS thermal graphite sheets are flexible (withstand repeated bending) and can be cut into customized shapes. Applications include cellular phones, DVC, DSC, PC and peripherals, pickup, semiconductor manufacturing equipment, and optical communications equipment.
Varastotiedot eivät ole tilapäisesti saatavilla.
Tarkista myöhemmin uudelleen.
€ 37,10
kpl (ilman ALV)
€ 46,56
kpl (Sis ALV:n)
1
€ 37,10
kpl (ilman ALV)
€ 46,56
kpl (Sis ALV:n)
1
Osta irtotavarana
Määrä | Yksikköhinta |
---|---|
1 - 4 | € 37,10 |
5 - 9 | € 35,00 |
10+ | € 31,80 |
Tekninen dokumentti
Tekniset tiedot
Merkki
PanasonicDimensions
115 x 90mm
Thickness
0.07mm
Length
115mm
Width
90mm
Thermal Conductivity
1000W/m·K
Material
Graphite
Self-Adhesive
Yes
Alkuperämaa
Japan
Tuotetiedot
Panasonic Pyrolytic Graphite Sheet (PGS) Type EYG
These range of Panasonic PGS thermal graphite sheet is a very thin, synthetically-made, highly oriented graphite polymer film manufactured for thermal management/heat-sink applications. The PGS graphite sheets are particularly well-suited for use in constrained spaces or to provide supplemental heat-sinking to existing areas. With excellent thermal conductivity (2 to 4 times that of copper), Panasonic 's PGS thermal graphite sheets are flexible (withstand repeated bending) and can be cut into customized shapes. Applications include cellular phones, DVC, DSC, PC and peripherals, pickup, semiconductor manufacturing equipment, and optical communications equipment.