TE Connectivity AMPMODU System 50 Series Straight Surface Mount PCB Socket, 30-Contact, 2-Row, 1.27mm Pitch, Solder

RS tilauskoodi: 164-7483Tuotemerkki: TE ConnectivityValmistajan osanumero.: 5-104652-3
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Tekninen dokumentti

Tekniset tiedot

Number Of Contacts

30

Number Of Rows

2

Pitch

1.27mm

Type

Socket Strip

Mounting Type

Surface Mount

Body Orientation

Straight

Termination Method

Solder

Current Rating

12A

Voltage Rating

30 V

Series

AMPMODU System 50

Contact Material

Copper

PRICED TO CLEAR

Yes

Alkuperämaa

United States

Tuotetiedot

TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Grid Board to Board Vertical Receptacles

AMPMODU 50/50 1.27mm x 1.27mm grid board to board vertical receptacles for SMT parallel board to board stacking in high density .050 x .050 applications. Parallel board to board stack heights of 6.35mm, 8.13mm and 9.91mm can by achieved using the same receptacle and selecting the appropriate header (board to board .050 x.050 double row vertical and right angle headers). These AMPMODU 50/50 1.27mm x 1.27mm vertical SMT board to board receptacle connectors have UL 94V-0 black glass filled thermoplastic housings, PCB hold down posts, polarizing tabs, gold plated contacts and are compatible with IR (infrared) and VPR(vapour phase reflow) surface mount processes.

Approvals

UL 94V-0

TE Connectivity AMPMODU 50/50 1.27mm Connectors

The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.

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Varastotiedot eivät ole tilapäisesti saatavilla.

€ 6,20

1 kpl (22 kpl/putki) (ilman ALV)

€ 7,688

1 kpl (22 kpl/putki) (Sis ALV:n)

TE Connectivity AMPMODU System 50 Series Straight Surface Mount PCB Socket, 30-Contact, 2-Row, 1.27mm Pitch, Solder

€ 6,20

1 kpl (22 kpl/putki) (ilman ALV)

€ 7,688

1 kpl (22 kpl/putki) (Sis ALV:n)

TE Connectivity AMPMODU System 50 Series Straight Surface Mount PCB Socket, 30-Contact, 2-Row, 1.27mm Pitch, Solder
Varastotiedot eivät ole tilapäisesti saatavilla.

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Tekninen dokumentti

Tekniset tiedot

Number Of Contacts

30

Number Of Rows

2

Pitch

1.27mm

Type

Socket Strip

Mounting Type

Surface Mount

Body Orientation

Straight

Termination Method

Solder

Current Rating

12A

Voltage Rating

30 V

Series

AMPMODU System 50

Contact Material

Copper

PRICED TO CLEAR

Yes

Alkuperämaa

United States

Tuotetiedot

TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Grid Board to Board Vertical Receptacles

AMPMODU 50/50 1.27mm x 1.27mm grid board to board vertical receptacles for SMT parallel board to board stacking in high density .050 x .050 applications. Parallel board to board stack heights of 6.35mm, 8.13mm and 9.91mm can by achieved using the same receptacle and selecting the appropriate header (board to board .050 x.050 double row vertical and right angle headers). These AMPMODU 50/50 1.27mm x 1.27mm vertical SMT board to board receptacle connectors have UL 94V-0 black glass filled thermoplastic housings, PCB hold down posts, polarizing tabs, gold plated contacts and are compatible with IR (infrared) and VPR(vapour phase reflow) surface mount processes.

Approvals

UL 94V-0

TE Connectivity AMPMODU 50/50 1.27mm Connectors

The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.