Tekninen dokumentti
Tekniset tiedot
Merkki
WinbondMemory Size
1Gbit
Interface Type
Quad-SPI
Package Type
TFBGA
Pin Count
24
Organisation
128M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
8.05 x 6.05 x 0.85mm
Number of Bits per Word
8bit
Number of Words
128M
Minimum Operating Temperature
-40 °C
Maximum Operating Temperature
+85 °C
Varastotiedot eivät ole tilapäisesti saatavilla.
Tarkista myöhemmin uudelleen.
€ 1,40
Each (In a Tray of 480) (ilman ALV)
€ 1,736
Each (In a Tray of 480) (Sis ALV:n)
480
€ 1,40
Each (In a Tray of 480) (ilman ALV)
€ 1,736
Each (In a Tray of 480) (Sis ALV:n)
480
Tekninen dokumentti
Tekniset tiedot
Merkki
WinbondMemory Size
1Gbit
Interface Type
Quad-SPI
Package Type
TFBGA
Pin Count
24
Organisation
128M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
8.05 x 6.05 x 0.85mm
Number of Bits per Word
8bit
Number of Words
128M
Minimum Operating Temperature
-40 °C
Maximum Operating Temperature
+85 °C