Tekninen dokumentti
Tekniset tiedot
Merkki
WinbondMemory Size
8Mbit
Interface Type
SPI
Package Type
SOIC
Pin Count
8
Organisation
1M x 8
Mounting Type
Surface Mount
Cell Type
NOR
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Block Organisation
Symmetrical
Length
5.38mm
Height
1.91mm
Width
5.38mm
Dimensions
5.38 x 5.38 x 1.91mm
Series
W25Q
Number of Words
1M
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Maximum Random Access Time
6ns
Varastotiedot eivät ole tilapäisesti saatavilla.
Tarkista myöhemmin uudelleen.
€ 0,697
Each (In a Tray of 300) (ilman ALV)
€ 0,864
Each (In a Tray of 300) (Sis ALV:n)
300
€ 0,697
Each (In a Tray of 300) (ilman ALV)
€ 0,864
Each (In a Tray of 300) (Sis ALV:n)
300
Tekninen dokumentti
Tekniset tiedot
Merkki
WinbondMemory Size
8Mbit
Interface Type
SPI
Package Type
SOIC
Pin Count
8
Organisation
1M x 8
Mounting Type
Surface Mount
Cell Type
NOR
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Block Organisation
Symmetrical
Length
5.38mm
Height
1.91mm
Width
5.38mm
Dimensions
5.38 x 5.38 x 1.91mm
Series
W25Q
Number of Words
1M
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Maximum Random Access Time
6ns