Tekninen dokumentti
Tekniset tiedot
Merkki
WinbondMemory Size
2Mbit
Interface Type
SPI
Package Type
SOIC
Pin Count
8
Organisation
256k x 8
Mounting Type
Surface Mount
Cell Type
NOR
Minimum Operating Supply Voltage
2.3 V
Maximum Operating Supply Voltage
3.6 V
Block Organisation
Symmetrical
Length
5mm
Height
1.5mm
Width
4mm
Dimensions
5 x 4 x 1.5mm
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Maximum Random Access Time
8ns
Series
W25X
Number of Words
256K
Minimum Operating Temperature
-40 °C
Varastotiedot eivät ole tilapäisesti saatavilla.
Tarkista myöhemmin uudelleen.
€ 0,33
1 kpl (100 kpl/putki) (ilman ALV)
€ 0,409
1 kpl (100 kpl/putki) (Sis ALV:n)
100
€ 0,33
1 kpl (100 kpl/putki) (ilman ALV)
€ 0,409
1 kpl (100 kpl/putki) (Sis ALV:n)
100
Tekninen dokumentti
Tekniset tiedot
Merkki
WinbondMemory Size
2Mbit
Interface Type
SPI
Package Type
SOIC
Pin Count
8
Organisation
256k x 8
Mounting Type
Surface Mount
Cell Type
NOR
Minimum Operating Supply Voltage
2.3 V
Maximum Operating Supply Voltage
3.6 V
Block Organisation
Symmetrical
Length
5mm
Height
1.5mm
Width
4mm
Dimensions
5 x 4 x 1.5mm
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Maximum Random Access Time
8ns
Series
W25X
Number of Words
256K
Minimum Operating Temperature
-40 °C