Tekninen dokumentti
Tekniset tiedot
Merkki
WinslowPitch
0.5 mm, 2.54 mm
End 1
10 Pin Female SOP
End 2
10 Pin Male DIP
End 1 Number of Contacts
10
End 2 Number of Contacts
10
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Alkuperämaa
United Kingdom
Tuotetiedot
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
€ 35,50
€ 7,10 1 kpl (5 kpl/pakkaus) (ilman ALV)
€ 44,55
€ 8,91 1 kpl (5 kpl/pakkaus) (Sis ALV:n)
5
€ 35,50
€ 7,10 1 kpl (5 kpl/pakkaus) (ilman ALV)
€ 44,55
€ 8,91 1 kpl (5 kpl/pakkaus) (Sis ALV:n)
Varastotiedot eivät ole tilapäisesti saatavilla.
5
Varastotiedot eivät ole tilapäisesti saatavilla.
Määrä | Yksikköhinta | Per Pakkaus |
---|---|---|
5 - 120 | € 7,10 | € 35,50 |
125 - 370 | € 6,40 | € 32,00 |
375 - 995 | € 5,70 | € 28,50 |
1000 - 1995 | € 5,00 | € 25,00 |
2000+ | € 4,65 | € 23,25 |
Tekninen dokumentti
Tekniset tiedot
Merkki
WinslowPitch
0.5 mm, 2.54 mm
End 1
10 Pin Female SOP
End 2
10 Pin Male DIP
End 1 Number of Contacts
10
End 2 Number of Contacts
10
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Alkuperämaa
United Kingdom
Tuotetiedot
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.