Tekninen dokumentti
Tekniset tiedot
Merkki
TE ConnectivityNumber Of Contacts
32
Mounting Type
Through Hole
Pin Type
Stamped
Pitch
2.54mm
Row Width
15.24mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
40.64mm
Width
4.57mm
Depth
17.78mm
Dimensions
40.64 x 4.57 x 17.78mm
Minimum Operating Temperature
-55°C
Maximum Operating Temperature
+105°C
Housing Material
PCT
Contact Material
Beryllium Copper
Series
Economy 800
Tuotetiedot
TE Connectivity PCB DIP Sockets with Stamped and Formed Contacts - Economy 800 Series
Economy 800 series PCB DIP sockets with open ladder style frame and 2.54mm centerline. These PCB DIP IC sockets mount vertically and have stamped and formed gold plated contacts with four fingered mating.
Varastotiedot eivät ole tilapäisesti saatavilla.
Tarkista myöhemmin uudelleen.
€ 3,15
1 kpl (15 kpl/putki) (ilman ALV)
€ 3,953
1 kpl (15 kpl/putki) (Sis ALV:n)
15
€ 3,15
1 kpl (15 kpl/putki) (ilman ALV)
€ 3,953
1 kpl (15 kpl/putki) (Sis ALV:n)
15
Osta irtotavarana
Määrä | Yksikköhinta | Per Putki |
---|---|---|
15 - 360 | € 3,15 | € 47,25 |
375 - 1110 | € 2,75 | € 41,25 |
1125 - 2985 | € 2,55 | € 38,25 |
3000 - 5985 | € 2,35 | € 35,25 |
6000+ | € 2,20 | € 33,00 |
Tekninen dokumentti
Tekniset tiedot
Merkki
TE ConnectivityNumber Of Contacts
32
Mounting Type
Through Hole
Pin Type
Stamped
Pitch
2.54mm
Row Width
15.24mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
40.64mm
Width
4.57mm
Depth
17.78mm
Dimensions
40.64 x 4.57 x 17.78mm
Minimum Operating Temperature
-55°C
Maximum Operating Temperature
+105°C
Housing Material
PCT
Contact Material
Beryllium Copper
Series
Economy 800
Tuotetiedot
TE Connectivity PCB DIP Sockets with Stamped and Formed Contacts - Economy 800 Series
Economy 800 series PCB DIP sockets with open ladder style frame and 2.54mm centerline. These PCB DIP IC sockets mount vertically and have stamped and formed gold plated contacts with four fingered mating.