Technical Documents
Specifications
Brand
STMicroelectronicsProduct Type
Chip Balun
Balance Impedance
100Ω
Maximum Insertion Loss
1.2dB
Mount Type
Surface
Pin Count
6
Maximum Frequency
8GHz
Minimum Frequency
3GHz
Minimum Operating Temperature
-40°C
Package Type
Bumpless CSP
Maximum Operating Temperature
105°C
Standards/Approvals
No
Length
1.825mm
Country of Origin
China
Product Details
The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 Ghz. This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
Stock information temporarily unavailable.
€ 12.20
€ 0.488 Each (In a Pack of 25) (Exc. Vat)
€ 15.31
€ 0.612 Each (In a Pack of 25) (inc. VAT)
25
€ 12.20
€ 0.488 Each (In a Pack of 25) (Exc. Vat)
€ 15.31
€ 0.612 Each (In a Pack of 25) (inc. VAT)
Stock information temporarily unavailable.
25
Technical Documents
Specifications
Brand
STMicroelectronicsProduct Type
Chip Balun
Balance Impedance
100Ω
Maximum Insertion Loss
1.2dB
Mount Type
Surface
Pin Count
6
Maximum Frequency
8GHz
Minimum Frequency
3GHz
Minimum Operating Temperature
-40°C
Package Type
Bumpless CSP
Maximum Operating Temperature
105°C
Standards/Approvals
No
Length
1.825mm
Country of Origin
China
Product Details
The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 Ghz. This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
