Technical Document
Specifications
Brand
STMicroelectronicsDirection Type
Bi-Directional
Maximum Clamping Voltage
39.3V
Minimum Breakdown Voltage
20V
Mounting Type
Surface Mount
Package Type
SMB
Maximum Reverse Stand-off Voltage
18V
Pin Count
2
Peak Pulse Power Dissipation
600W
Maximum Peak Pulse Current
102A
Number of Elements per Chip
1
Minimum Operating Temperature
-55 °C
Dimensions
4.6 x 3.95 x 2.45mm
Maximum Operating Temperature
+150 °C
Maximum Reverse Leakage Current
200nA
Height
2.45mm
Test Current
1mA
Length
4.6mm
Width
3.95mm
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Price on Asking
Each (In a Pack of 5) (Exc. Vat)
5
Price on Asking
Each (In a Pack of 5) (Exc. Vat)
Stock information temporarily unavailable.
5
Technical Document
Specifications
Brand
STMicroelectronicsDirection Type
Bi-Directional
Maximum Clamping Voltage
39.3V
Minimum Breakdown Voltage
20V
Mounting Type
Surface Mount
Package Type
SMB
Maximum Reverse Stand-off Voltage
18V
Pin Count
2
Peak Pulse Power Dissipation
600W
Maximum Peak Pulse Current
102A
Number of Elements per Chip
1
Minimum Operating Temperature
-55 °C
Dimensions
4.6 x 3.95 x 2.45mm
Maximum Operating Temperature
+150 °C
Maximum Reverse Leakage Current
200nA
Height
2.45mm
Test Current
1mA
Length
4.6mm
Width
3.95mm


