Tekninen Dokumentti
Tekniset tiedot
Merkki
MicrochipProduct Type
Bluetooth Chip
Bluetooth Class
Class 2
Bluetooth Version
4.1
Maximum Output Power
4dBm
Receiver Sensitivity
-91dBm
Frequency
2.48GHz
Interface Type
UART, I2S
Minimum Supply Voltage
2.7V
Maximum Supply Voltage
3.3V
Minimum Operating Temperature
-20°C
Maximum Operating Temperature
70°C
Length
322.6mm
Height
7.62mm
Standards/Approvals
No
Series
BM20
Tuotetiedot
The BM20 stereo module is a Bluetooth® (BDR/EDR) module for designers who want to add Bluetooth wireless audio and voice applications to their products. This module provides a complete wireless solution with Bluetooth stack, integrated antenna, and worldwide radio certifications in a compact surface mount package, 29 x 15 x 2.5 mm3. This stereo module contains a digital audio interface. It supports HSP, HFP, SPP, A2DP, and AVRCP profiles.
Varastotiedot eivät ole tilapäisesti saatavilla.
€ 567,00
€ 9,00 Each (In a Tray of 63) (ilman ALV)
€ 711,58
€ 11,295 Each (In a Tray of 63) (Sis ALV:n)
63
€ 567,00
€ 9,00 Each (In a Tray of 63) (ilman ALV)
€ 711,58
€ 11,295 Each (In a Tray of 63) (Sis ALV:n)
Varastotiedot eivät ole tilapäisesti saatavilla.
63
Tekninen Dokumentti
Tekniset tiedot
Merkki
MicrochipProduct Type
Bluetooth Chip
Bluetooth Class
Class 2
Bluetooth Version
4.1
Maximum Output Power
4dBm
Receiver Sensitivity
-91dBm
Frequency
2.48GHz
Interface Type
UART, I2S
Minimum Supply Voltage
2.7V
Maximum Supply Voltage
3.3V
Minimum Operating Temperature
-20°C
Maximum Operating Temperature
70°C
Length
322.6mm
Height
7.62mm
Standards/Approvals
No
Series
BM20
Tuotetiedot
The BM20 stereo module is a Bluetooth® (BDR/EDR) module for designers who want to add Bluetooth wireless audio and voice applications to their products. This module provides a complete wireless solution with Bluetooth stack, integrated antenna, and worldwide radio certifications in a compact surface mount package, 29 x 15 x 2.5 mm3. This stereo module contains a digital audio interface. It supports HSP, HFP, SPP, A2DP, and AVRCP profiles.
