
Tekninen Dokumentti
Tekniset tiedot
Merkki
MolexSeries
Micro-One
Product Type
PCB Header
Current
4A
Pitch
2mm
Housing Material
Polyamide
Number of Contacts
5
Number of Rows
1
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Micro One Wire to Board Connector System
Mount Type
Surface
Contact Material
Brass
Contact Plating
Tin Bismuth
Row Pitch
2mm
Termination Type
Surface Mount
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
105°C
Contact Gender
Male
Standards/Approvals
CHINA RoHS, EU RoHS
Voltage
250V
Alkuperämaa
Malaysia
Tuotetiedot
The Molex right angle header or wire to board connector with integrated independent secondary locking confirm proper terminal insertion and prevents accidental back outs to execute a secure electrical contact and improved pairing retention in high vibration applications.
Varastotiedot eivät ole tilapäisesti saatavilla.
€ 687,50
€ 1,25 1 kpl (550 kpl/kela) (ilman ALV)
€ 862,81
€ 1,569 1 kpl (550 kpl/kela) (Sis ALV:n)
550
€ 687,50
€ 1,25 1 kpl (550 kpl/kela) (ilman ALV)
€ 862,81
€ 1,569 1 kpl (550 kpl/kela) (Sis ALV:n)
Varastotiedot eivät ole tilapäisesti saatavilla.
550
| Määrä | Yksikköhinta | Per Kela |
|---|---|---|
| 550 - 550 | € 1,25 | € 687,50 |
| 1100+ | € 1,20 | € 660,00 |
Tekninen Dokumentti
Tekniset tiedot
Merkki
MolexSeries
Micro-One
Product Type
PCB Header
Current
4A
Pitch
2mm
Housing Material
Polyamide
Number of Contacts
5
Number of Rows
1
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Micro One Wire to Board Connector System
Mount Type
Surface
Contact Material
Brass
Contact Plating
Tin Bismuth
Row Pitch
2mm
Termination Type
Surface Mount
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
105°C
Contact Gender
Male
Standards/Approvals
CHINA RoHS, EU RoHS
Voltage
250V
Alkuperämaa
Malaysia
Tuotetiedot
The Molex right angle header or wire to board connector with integrated independent secondary locking confirm proper terminal insertion and prevents accidental back outs to execute a secure electrical contact and improved pairing retention in high vibration applications.