Tekninen dokumentti
Tekniset tiedot
Merkki
MolexProduct Type
PCB Header
Series
Micro-Fit 3.0
Pitch
3mm
Current
5A
Number of Contacts
2
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
125°C
Mating Pin Length
3mm
Standards/Approvals
No
Voltage
250V
Tuotetiedot
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Varastotiedot eivät ole tilapäisesti saatavilla.
€ 84,40
€ 0,844 kpl (toimitus pussissa) (ilman ALV)
€ 105,92
€ 1,059 kpl (toimitus pussissa) (Sis ALV:n)
Tuotantopakkaus (Pussi)
100
€ 84,40
€ 0,844 kpl (toimitus pussissa) (ilman ALV)
€ 105,92
€ 1,059 kpl (toimitus pussissa) (Sis ALV:n)
Varastotiedot eivät ole tilapäisesti saatavilla.
Tuotantopakkaus (Pussi)
100
Tekninen dokumentti
Tekniset tiedot
Merkki
MolexProduct Type
PCB Header
Series
Micro-Fit 3.0
Pitch
3mm
Current
5A
Number of Contacts
2
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
125°C
Mating Pin Length
3mm
Standards/Approvals
No
Voltage
250V
Tuotetiedot
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.