Tekninen Dokumentti
Tekniset tiedot
Merkki
MolexProduct Type
PCB Header
Series
43045
Pitch
3mm
Current
8.5A
Number of Contacts
8
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Mount Type
Through Hole
Connector System
Micro Fit 3.0
Contact Material
Brass
Contact Plating
Tin
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Tin
Maximum Operating Temperature
105°C
Standards/Approvals
No
Voltage
600V
Alkuperämaa
China
Tuotetiedot
The Molex micro-fit 3.0 interconnect system is designed to meet the need for a high contact density signal or power connector. Micro-fit 3.0 right angle header it is dual row and 8 circuits are loaded with PCB press-fit metal retention clip and glow-wire
Ideoi. Luo. Tee yhteistyötä
LIITY ILMAISEKSI
Ei piilokuluja!
Varastotiedot eivät ole tilapäisesti saatavilla.
€ 168,00
€ 1,40 Each (In a Tray of 120) (ilman ALV)
€ 210,84
€ 1,757 Each (In a Tray of 120) (Sis ALV:n)
120
€ 168,00
€ 1,40 Each (In a Tray of 120) (ilman ALV)
€ 210,84
€ 1,757 Each (In a Tray of 120) (Sis ALV:n)
Varastotiedot eivät ole tilapäisesti saatavilla.
120
Ideoi. Luo. Tee yhteistyötä
LIITY ILMAISEKSI
Ei piilokuluja!
Tekninen Dokumentti
Tekniset tiedot
Merkki
MolexProduct Type
PCB Header
Series
43045
Pitch
3mm
Current
8.5A
Number of Contacts
8
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Mount Type
Through Hole
Connector System
Micro Fit 3.0
Contact Material
Brass
Contact Plating
Tin
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Tin
Maximum Operating Temperature
105°C
Standards/Approvals
No
Voltage
600V
Alkuperämaa
China
Tuotetiedot
The Molex micro-fit 3.0 interconnect system is designed to meet the need for a high contact density signal or power connector. Micro-fit 3.0 right angle header it is dual row and 8 circuits are loaded with PCB press-fit metal retention clip and glow-wire
Ideoi. Luo. Tee yhteistyötä
LIITY ILMAISEKSI
Ei piilokuluja!
