Tekninen Dokumentti
Tekniset tiedot
Merkki
MolexNumber of Contacts
64
Product Type
PCB Socket
Number of Rows
2
Sub Type
Socket
Pitch
1mm
Current
1A
Termination Type
Surface Mount
Housing Material
High Temperature Thermoplastic
Mount Type
Surface Mount
Orientation
Vertical
Stacking Height
13mm
Connector System
Board-to-Board
Voltage
100V
Series
71439
Minimum Operating Temperature
-55°C
Maximum Operating Temperature
85°C
Contact Material
Phosphor Bronze
Contact Plating
Gold
Standards/Approvals
UL
Alkuperämaa
China
Tuotetiedot
The Molex 1.00mm Mezzanine Receptacle is expertly designed for seamless board-to-board connectivity in high-performance applications. This component delivers exceptional reliability with its dual-row configuration, offering 64 circuits to facilitate robust signal transmission. The surface mount design enhances installation efficiency, while the vertical stacking capability significantly optimises space utilisation on PCBs. With a gold-plated mating surface and Advanced high-temperature thermoplastic materials, this receptacle ensures durability and compliance with various industry standards, making it an Ideal choice for modern electronic systems.
Varastotiedot eivät ole tilapäisesti saatavilla.
€ 262,00
€ 262,00 30 kpl:n putki (ilman ALV)
€ 328,81
€ 328,81 30 kpl:n putki (Sis ALV:n)
1
€ 262,00
€ 262,00 30 kpl:n putki (ilman ALV)
€ 328,81
€ 328,81 30 kpl:n putki (Sis ALV:n)
Varastotiedot eivät ole tilapäisesti saatavilla.
1
Tekninen Dokumentti
Tekniset tiedot
Merkki
MolexNumber of Contacts
64
Product Type
PCB Socket
Number of Rows
2
Sub Type
Socket
Pitch
1mm
Current
1A
Termination Type
Surface Mount
Housing Material
High Temperature Thermoplastic
Mount Type
Surface Mount
Orientation
Vertical
Stacking Height
13mm
Connector System
Board-to-Board
Voltage
100V
Series
71439
Minimum Operating Temperature
-55°C
Maximum Operating Temperature
85°C
Contact Material
Phosphor Bronze
Contact Plating
Gold
Standards/Approvals
UL
Alkuperämaa
China
Tuotetiedot
The Molex 1.00mm Mezzanine Receptacle is expertly designed for seamless board-to-board connectivity in high-performance applications. This component delivers exceptional reliability with its dual-row configuration, offering 64 circuits to facilitate robust signal transmission. The surface mount design enhances installation efficiency, while the vertical stacking capability significantly optimises space utilisation on PCBs. With a gold-plated mating surface and Advanced high-temperature thermoplastic materials, this receptacle ensures durability and compliance with various industry standards, making it an Ideal choice for modern electronic systems.