Tekninen Dokumentti
Tekniset tiedot
Merkki
onsemiProduct Type
Optocoupler
Mount Type
Surface
Maximum Forward Voltage
1.3V
Number of Channels
1
Packaging
Tape & Reel
Number of Pins
8
Package Type
SOIC
Input Current Type
DC
Typical Rise Time
8μs
Maximum Input Current
60mA
Logic Output
Yes
Minimum Operating Temperature
-40°C
Maximum Current Transfer Ratio
1000%
Maximum Operating Temperature
100°C
Typical Fall Time
45μs
Minimum Current Transfer Ratio
500%
Standards/Approvals
DIN, UL, EN
Series
MOCD
Automotive Standard
No
Alkuperämaa
Thailand
Tuotetiedot
The MOCD223M consists of a gallium arsenide infrared emitting diode optically coupled to a monolithic silicon photo darlington detector, in a surface mountable, small outline, plastic package. The MOCD223M is a dual-channel version of the MOC223M. They are ideally suited for high density applications, and eliminates the need for through the board mounting.
Varastotiedot eivät ole tilapäisesti saatavilla.
€ 1 407,50
€ 0,563 1 kpl (2500 kpl/kela) (ilman ALV)
€ 1 766,41
€ 0,707 1 kpl (2500 kpl/kela) (Sis ALV:n)
2500
€ 1 407,50
€ 0,563 1 kpl (2500 kpl/kela) (ilman ALV)
€ 1 766,41
€ 0,707 1 kpl (2500 kpl/kela) (Sis ALV:n)
Varastotiedot eivät ole tilapäisesti saatavilla.
2500
Tekninen Dokumentti
Tekniset tiedot
Merkki
onsemiProduct Type
Optocoupler
Mount Type
Surface
Maximum Forward Voltage
1.3V
Number of Channels
1
Packaging
Tape & Reel
Number of Pins
8
Package Type
SOIC
Input Current Type
DC
Typical Rise Time
8μs
Maximum Input Current
60mA
Logic Output
Yes
Minimum Operating Temperature
-40°C
Maximum Current Transfer Ratio
1000%
Maximum Operating Temperature
100°C
Typical Fall Time
45μs
Minimum Current Transfer Ratio
500%
Standards/Approvals
DIN, UL, EN
Series
MOCD
Automotive Standard
No
Alkuperämaa
Thailand
Tuotetiedot
The MOCD223M consists of a gallium arsenide infrared emitting diode optically coupled to a monolithic silicon photo darlington detector, in a surface mountable, small outline, plastic package. The MOCD223M is a dual-channel version of the MOC223M. They are ideally suited for high density applications, and eliminates the need for through the board mounting.
