Tekninen Dokumentti
Tekniset tiedot
Merkki
SamtecNumber of Contacts
160
Product Type
PCB Socket
Number of Rows
2
Sub Type
Terminal Assembly
Pitch
0.5mm
Current
2.7A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
10mm
Connector System
Board-to-Board
Voltage
339V
Series
ASP
Minimum Operating Temperature
-55°C
Row Pitch
6.18mm
Contact Gender
Male
Maximum Operating Temperature
125°C
Contact Material
Bronze
Contact Plating
Gold over Nickel
Standards/Approvals
RoHS
Alkuperämaa
Costa Rica
Tuotetiedot
Altera® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in todays FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.
Ideoi. Luo. Tee yhteistyötä
LIITY ILMAISEKSI
Ei piilokuluja!
Varastotiedot eivät ole tilapäisesti saatavilla.
€ 14,70
€ 14,70 kpl (ilman ALV)
€ 18,45
€ 18,45 kpl (Sis ALV:n)
1
€ 14,70
€ 14,70 kpl (ilman ALV)
€ 18,45
€ 18,45 kpl (Sis ALV:n)
Varastotiedot eivät ole tilapäisesti saatavilla.
1
Ideoi. Luo. Tee yhteistyötä
LIITY ILMAISEKSI
Ei piilokuluja!
Tekninen Dokumentti
Tekniset tiedot
Merkki
SamtecNumber of Contacts
160
Product Type
PCB Socket
Number of Rows
2
Sub Type
Terminal Assembly
Pitch
0.5mm
Current
2.7A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
10mm
Connector System
Board-to-Board
Voltage
339V
Series
ASP
Minimum Operating Temperature
-55°C
Row Pitch
6.18mm
Contact Gender
Male
Maximum Operating Temperature
125°C
Contact Material
Bronze
Contact Plating
Gold over Nickel
Standards/Approvals
RoHS
Alkuperämaa
Costa Rica
Tuotetiedot
Altera® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in todays FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.
Ideoi. Luo. Tee yhteistyötä
LIITY ILMAISEKSI
Ei piilokuluja!
