Tekninen Dokumentti
Tekniset tiedot
Merkki
STMicroelectronicsProduct Type
Chip Balun
Balance Impedance
100Ω
Maximum Insertion Loss
1.2dB
Mount Type
Surface
Pin Count
6
Maximum Frequency
8GHz
Minimum Frequency
3GHz
Minimum Operating Temperature
-40°C
Package Type
Bumpless CSP
Maximum Operating Temperature
105°C
Length
1.825mm
Standards/Approvals
No
Alkuperämaa
China
Tuotetiedot
The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 Ghz. This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
Varastotiedot eivät ole tilapäisesti saatavilla.
€ 1 785,00
€ 0,357 1 kpl (5000 kpl/kela) (ilman ALV)
€ 2 240,18
€ 0,448 1 kpl (5000 kpl/kela) (Sis ALV:n)
5000
€ 1 785,00
€ 0,357 1 kpl (5000 kpl/kela) (ilman ALV)
€ 2 240,18
€ 0,448 1 kpl (5000 kpl/kela) (Sis ALV:n)
Varastotiedot eivät ole tilapäisesti saatavilla.
5000
Tekninen Dokumentti
Tekniset tiedot
Merkki
STMicroelectronicsProduct Type
Chip Balun
Balance Impedance
100Ω
Maximum Insertion Loss
1.2dB
Mount Type
Surface
Pin Count
6
Maximum Frequency
8GHz
Minimum Frequency
3GHz
Minimum Operating Temperature
-40°C
Package Type
Bumpless CSP
Maximum Operating Temperature
105°C
Length
1.825mm
Standards/Approvals
No
Alkuperämaa
China
Tuotetiedot
The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 Ghz. This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
